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Reconfigurable FeHEMTs Could Redefine Communications

A team of researchers from the University of Michigan has demonstrated a reconfigurable ferroelectric high electron mobility transistor (FeHEMT) that can be modified on the fly and which could be

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Micron’s 4150AT SSD to Meet Next-Gen Automotive Storage Needs

There are still some functions of vehicles that must feature even more stringent functional safety. The post Micron’s 4150AT SSD to Meet Next-Gen Automotive Storage Needs appeared first on EE Times.

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Micron’s 4150AT SSD to Meet Next-Gen Automotive Storage Needs

There are still some functions of vehicles that must feature even more stringent functional safety. The post Micron’s 4150AT SSD to Meet Next-Gen Automotive Storage Needs appeared first on EE Times.

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Micron’s 4150AT SSD to Meet Next-Gen Automotive Storage Needs

There are still some functions of vehicles that must feature even more stringent functional safety. The post Micron’s 4150AT SSD to Meet Next-Gen Automotive Storage Needs appeared first on EE Times.

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Reconfigurable FeHEMTs Could Redefine Communications

A team of researchers from the University of Michigan has demonstrated a reconfigurable ferroelectric high electron mobility transistor (FeHEMT) that can be modified on the fly and which could be

View Article


Reconfigurable FeHEMTs Could Redefine Communications

A team of researchers from the University of Michigan has demonstrated a reconfigurable ferroelectric high electron mobility transistor (FeHEMT) that can be modified on the fly and which could be

View Article

Reconfigurable FeHEMTs Could Redefine Communications

A team of researchers from the University of Michigan has demonstrated a reconfigurable ferroelectric high electron mobility transistor (FeHEMT) that can be modified on the fly and which could be

View Article

Micron’s 4150AT SSD to Meet Next-Gen Automotive Storage Needs

There are still some functions of vehicles that must feature even more stringent functional safety. The post Micron’s 4150AT SSD to Meet Next-Gen Automotive Storage Needs appeared first on EE Times.

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SandBox Using AI, Hybrid Metrology to Cut Costs, Boost Yields

The tool promises to improve accuracy for etch and deposition steps. The post SandBox Using AI, Hybrid Metrology to Cut Costs, Boost Yields appeared first on EE Times.

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Micron Bringing LPDDR5X to Desktops, Laptops, Data Centers

The LPCAMM2 modules from Micron address applications that need to bring together low power consumption and high performance. The post Micron Bringing LPDDR5X to Desktops, Laptops, Data Centers appeared...

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Reconfigurable FeHEMTs Could Redefine Communications

A team of researchers from the University of Michigan has demonstrated a reconfigurable ferroelectric high electron mobility transistor (FeHEMT) that can be modified on the fly and which could be

View Article

SandBox Using AI, Hybrid Metrology to Cut Costs, Boost Yields

The tool promises to improve accuracy for etch and deposition steps. The post SandBox Using AI, Hybrid Metrology to Cut Costs, Boost Yields appeared first on EE Times.

View Article

Micron Bringing LPDDR5X to Desktops, Laptops, Data Centers

The LPCAMM2 modules from Micron address applications that need to bring together low power consumption and high performance. The post Micron Bringing LPDDR5X to Desktops, Laptops, Data Centers appeared...

View Article


Micron’s 4150AT SSD to Meet Next-Gen Automotive Storage Needs

There are still some functions of vehicles that must feature even more stringent functional safety. The post Micron’s 4150AT SSD to Meet Next-Gen Automotive Storage Needs appeared first on EE Times.

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The Golden Age of Custom Silicon Draws Near: Part 3

—Last in a three-part series. Read part one here and part two here. Traditional chip developers spend billions on R&D, and their budgets are rising—largely attributed to increased costs of chip...

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PCIe 5.0 Retimer Supports CXL 2.0, Extends Links

The device ensures that signal integrity is preserved along the way. The post PCIe 5.0 Retimer Supports CXL 2.0, Extends Links appeared first on EE Times.

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The Golden Age of Custom Silicon Draws Near: Part 3

—Last in a three-part series. Read part one here and part two here. Traditional chip developers spend billions on R&D, and their budgets are rising—largely attributed to increased costs of chip...

View Article


PCIe 5.0 Retimer Supports CXL 2.0, Extends Links

The device ensures that signal integrity is preserved along the way. The post PCIe 5.0 Retimer Supports CXL 2.0, Extends Links appeared first on EE Times.

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Reconfigurable FeHEMTs Could Redefine Communications

A team of researchers from the University of Michigan has demonstrated a reconfigurable ferroelectric high electron mobility transistor (FeHEMT) that can be modified on the fly and which could be

View Article

Understanding the Big Spend on Advanced Packaging Facilities

Manufacturers are making huge investments in advanced packaging. The post Understanding the Big Spend on Advanced Packaging Facilities appeared first on EE Times.

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